E&K printpanelen
  • Name of item Units required Delivery time
  • Number of layers Layer technology/structure Drills
  • Material Material thickness
  • Board dimensions and purpose
  • Copper layers Surface finish
  • Soldermask Silkscreen peelable mask
  • Layout
  • Comments Upload
1
2
5
10
25
50
100
250
500
1000
3 - 4 W (Std.)
10 WD
9 WD
8 WD
7 WD
6 WD
5 WD
4 WD
3 WD
2 WD
24 H
2
4
6
8
>=0.125mm
>=0.15mm
>=0.20mm
>=0.25mm
>=0.30mm
Standard
TG 135
TG 150
TG 170
High frequency laminates
RO 4003
RO 4350
RT 5870
High temperature polyimide laminates
35 N
Heat conducing laminates
R 1787 (1,0W/mK)
R 1586 (1,5W/mK)
0.5mm
0.8mm
1.0mm
1.2mm
1.55mm
2.0mm
2.4mm
3.2mm

( not possible in combination with )

Single board multi-purpose board
mm mm
mm mm
x
routing
scoring
scoring and routing
1.6 mm
2.0 mm
2.4 mm
Top: mm
Right: mm
Bottom: mm
Left: mm
Horizontal: mm
Vertical: mm
35µm
55µm
70µm
105µm
140µm

( not possible in combination with )

35µm
70µm
105µm

( not possible in combination with )

Chemical tin
Lead-free HAL
Chemical Nickel/Gold
Leaded HAL
without
single-sided
double-sided
green
white
black
blue
red
yellow
without
single-sided
double-sided
white
black
without
single-sided
double-sided
Carbon print
filled VIAs
plugges VIAs
Countersinks/Counterbores
Depth milling
Side plating
Plug gilding
  • Name of item:
    Units required:
    Delivery time:
  • Number of layers:
    Layer technology:
    Drills:
    Blind-VIAs:
    Buried-VIAs:
  • Material:
    Material thickness:
  • Dimensions:mm x mm
  • Copper layers.:outer
    Copper layers.:inner
    Surface finish:
  • Soldermask:
    Silkscreen:
    peelable mask:
  • Carbon print:
    filled VIAs:
    plugges VIAs:
    Countersinks/Counterbores:
    Depth milling:
    Side plating:
    Plug gilding:
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